Optoelectronic Module

RIM moulded baseplate

Microsystems manufacture will require small sub-components to be assembled rapidly and inexpensively next to one another and connections to be made to supply power, heat, light, etc. Often they may also need to be precisely aligned with each other.

Silicon micromachining techniques can be used to produce surfaces with photolithographically defined grooves and cavities. These can be used as the micro-bench (baseplate) on which to assemble the sub-components.

Epigem has demonstrated that a metal mould produced from such a surface can be used to manufacture inexpensive polymer replicas by reaction injection moulding (RIM) or embossing. The choice of micromoulding technique and material depends on the mechanical and thermal stability required for the baseplate.