Example 1: 15 micron wide tracks on 30 micron pitch fan
out to 100 micron pitch. Bond pads have 20 micron square
holes cut out. Track depth is 5 micron.

Example 2: 10 micron wide tracks on 100 micron pitch
taper to 4 micron wide. Square objects in top of picture
are 20 micron square. Track depth is 4 micron.

Example 3: 25 µm track width circuit
for fine pitch silicon die attachment.