'lab-on-a-chip' microfluidics devices

microlens arrays

ultra high resolution flexible circuit boards

polymer waveguides

other micro-optical products


Ultra high resolution flexible circuit boards

Adhesive/carrier substrate options

High transparency PEN flex board

Flexible carrier films that have been successfully used include:

  • Polyimide (PI)
  • Polyethylene Naphthlate (PEN)
  • Polyethylene Terephthalate (PET)
  • Polycarbonate (PC)
  • Polyether Sulphone (PES)
  • Polyarylate
  • Paper

Rigid substrates successfully used include:

  • Glass
  • Silicon
  • Polymethyl methacrylate (PMMA)
  • Polycarbonate (PC)

Choice of adhesive depends on carrier substrate and end use requirements. Materials are available that cover continuous upper use temperatures of up to 180°C. Short term temperatures up to 230°C are possible (when soldering onto the boards for example). Examples of adhesive materials available are:

  • Thermosetting polyacrylate
  • Thermosetting epoxy
  • Thermoplastic hot melt