Ultra high resolution flexible circuit boards

Overview
Epigem’s new flexible and rigid circuit boards offer the benefits of very small track and gap sizes at very competitive cost. We can do this by replacing conventional subtractive resist-based processes for making the board with a new, patented method based on UV embossing and additive metal plating (click here for more details about the process).

We are looking for partners who want to develop particular applications using this new technology and for potential licensees. Please contact us to discuss your end user requirements or if you want to know more about licensing opportunities.

Features

• 3 micron (minimum) width, 5 micron (minimum) gap width.
• 3 to 50 micron thick copper or nickel conductors (provided tracks are at least as wide as they are thick).
• Planar surface ideal for further over-coating, embossing of microstructures or lamination.
• Standard gold/nickel and pure tin board finishes available.
• Wide choice of carrier substrate and adhesive combinations to suit end application (click here for more details about the materials).

(click here to see examples)